vivo finally released its new self-developed chip, Image Signal Processor (ISP) called “V2”.
Since 2021, vivo has launched two generations of self-developed chips: the V1 and V1+. The V2 chip, which was made by the company itself, adopts a new iterative AI-ISP architecture. This technology brings comprehensive improvements in compatibility and functionality and significantly upgrades the on-chip memory unit, AI computing unit, and image processing unit. The proposed FIT dual-core connectivity technology provides a new high-speed communication method between V2 and MediaTek Dimensity 9200. Two chips with distinct architectures and instruction sets can accomplish dual-core interconnection synchronization in 1/100 seconds, enabling optimal data and computing power coordination.
According to reports, thanks to the DLA or vivo self-developed AI deep learning accelerator module and the large-capacity dedicated on-chip SRAM (high-speed and low-consumption cache unit), the V2 has unmatched computing power capacity, computing power density, and data density, greatly improving the capacity and computing speed of the on-chip cache.
Compared to the DDR external memory design commonly used by NPUs, the dedicated Static RAM (SRAM) cache unit can reduce high power consumption by over 99.2% and raise the power efficiency ratio to 200%.
Thanks to the structural design of FIT dual-core interconnection and DLA, it enables the AI-ISP architecture of the V2 chip to be established. It complements the ISP algorithm and computing power with the platform chip NPU to achieve the ultimate image processing effect and the ultimate energy efficiency ratio.
